PackageSO
Capacitance25(Typ)pF
MountingSurface Mount
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Technical Specifications
Microchip SM8LC03E3/TR7 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
3.94(Max)
Package Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Configuration
Dual
Type
TVS
Direction Type
Bi-Directional
Maximum Working Voltage
3.3V
Maximum Clamping Voltage
9V
Maximum Leakage Current
200uA
Capacitance
25(Typ)pF
Number of Elements per Chip
2
Min Operating Temperature
-55°C
Max Operating Temperature
150°C
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip SM8LC03E3/TR7 Datasheet
Download the complete datasheet for Microchip SM8LC03E3/TR7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.