This lead-frame SMT diode features a maximum reverse stand-off voltage of 11V, maximum reverse leakage current of 5uA, and maximum clamping voltage of 20.1V. It can handle a maximum peak pulse current of 149.2mA and a peak pulse power dissipation of 3000W. The diode operates over a temperature range of -65C to 150C and is packaged in a DO-215-AB plastic package.
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Microchip SMLG11CE3/TR7 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DO-215-AB |
| Package/Case | SMCG |
| Package Description | SMD Plastic Package |
| Lead Shape | Gull-wing |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 7.11(Max) |
| Package Width (mm) | 6.22(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | DO-215AB |
| Direction Type | Bi-Directional |
| Configuration | Single |
| Maximum Reverse Stand-Off Voltage | 11V |
| Maximum Reverse Leakage Current | 5uA |
| Maximum Clamping Voltage | 20.1V |
| Maximum Peak Pulse Current | 149.2A |
| Minimum Breakdown Voltage | 12.2V |
| Peak Pulse Power Dissipation | 3000W |
| Min Operating Temperature | -65°C |
| Max Operating Temperature | 150°C |
| Number of Elements per Chip | 1 |
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8541100080 |
| Schedule B | 8541100080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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