Microchip SP8855D/IG/HCAR technical specifications.
| Package Family Name | LCC |
| Package/Case | CLCC |
| Package Description | Ceramic Leadless Chip Carrier |
| Lead Shape | No Lead |
| Pin Count | 44 |
| PCB | 44 |
| Package Length (mm) | 16.81(Max) |
| Package Width (mm) | 16.81(Max) |
| Package Height (mm) | 3.43(Max) - 0.89(Max) |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 100°C |
| Cage Code | 60991 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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