PackageTSSOP
MountingSurface Mount
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Technical Specifications
Microchip SY898533LKZ technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.5
Package Width (mm)
4.4
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Type
Clock Multiplexer
Number of Outputs per Chip
4
Output Logic Level
LVPECL
Input Logic Level
CML|HCSL|LVDS|LVHSTL|LVPECL|SSTL
Min Operating Supply Voltage
3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
60991
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Microchip SY898533LKZ Datasheet
Download the complete datasheet for Microchip SY898533LKZ to view detailed technical specifications.
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