MLC NAND flash memory provides 64Gb density with an x8 bus organization and 8G x8 component configuration. The device uses a 3.3V I/O interface and supports 50MHz operation with 50MT/s transfer rate. It is supplied as a 48-pin TSOP component measuring 12.00 x 20.00 x 1.20mm. The cataloged commercial-temperature variant operates from 0°C to +70°C and is marked obsolete.
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| Component Density | 64Gb |
| Memory Technology | MLC NAND Flash |
| Bus Width | x8 |
| Component Configuration | 8G x8 |
| I/O Voltage | 3.3V |
| Clock Speed | 50MHz |
| Transfer Rate | 50MT/s |
| Operating Temperature | 0 to +70°C |
| Package | TSOP |
| Pin Count | 48pin |
| Package Dimensions | 12.00 x 20.00 x 1.20mm |
| Number of Components | 1 |
| Part Type | Component |
| Product Family | NAND FLASH |
| Dry Pack Quantity | 960pcs |
| Tape and Reel Quantity | 1000pcs |
| RoHS | Not Compliant |
These are design resources that include the Micron Technology MT29F64G08CBABAWP
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