32M-bit NOR Flash memory with a parallel interface, featuring 2M x 16 word organization and a 100ns maximum access time. This surface-mount component utilizes a 47-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 0.75mm pin pitch. It operates from 3V/3.3V supply voltages, supports asymmetrical block organization with a top boot block, and has a maximum operating current of 20mA. The device is rated for operation between 0°C and 70°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M28W320BT100ZB1T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
47
PCB
47
Package Length (mm)
10.5
Package Width (mm)
6.39
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|11.4 to 12.6V
Timing Type
Asynchronous
Maximum Access Time
100ns
Number of Words
2M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
21bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M28W320BT100ZB1T Datasheet
Download the complete datasheet for Micron M28W320BT100ZB1T to view detailed technical specifications.
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