32M-bit NOR Flash memory with a parallel interface, featuring 2M words x 16 bits per word. This surface-mount component offers a maximum access time of 70 ns and operates from 3V or 3.3V supply voltages, with programming voltages ranging from 2.7 to 3.6V and 11.4 to 12.6V. The memory is organized in asymmetrical sectors with a bottom boot block and utilizes a 21-bit address bus. Housed in a 64-pin TBGA package with a 13mm x 10mm footprint and 0.85mm maximum height, it operates across a temperature range of -40°C to 85°C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M28W320FSB70ZA6T technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.85(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 21bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Micron M28W320FSB70ZA6T Datasheet
Download the complete datasheet for Micron M28W320FSB70ZA6T to view detailed technical specifications.
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