32M-bit NOR Flash memory with a parallel interface, featuring 2M x 16 organization and a 70ns maximum access time. This surface-mount component utilizes a 64-pin Thin Profile Ball Grid Array (TBGA) package with a 1mm pin pitch. It operates from 3V/3.3V typical supply voltage and supports programming voltages from 2.7V to 3.6V and 11.4V to 12.6V. The memory architecture is sectored and asymmetrical, with an address bus width of 21 bits. Operating temperature range is -40°C to 85°C.
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Micron M28W320FSU70ZA6 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.85(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 18mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6|11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 70ns |
| Number of Words | 2M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3|3.3V |
| Address Bus Width | 21bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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