16M-bit NOR Flash memory, featuring a parallel interface and 1M x 16 organization. This integrated circuit operates at a typical 3.3V supply voltage with a maximum access time of 90ns. Housed in a 48-pin TFBGA package, it supports surface mounting and offers a 20-bit address bus. The component is designed for a 0°C to 70°C operating temperature range.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 9 |
| Package Width (mm) | 6 |
| Package Height (mm) | 1(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 10mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 11.4 to 12.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 90ns |
| Number of Words | 1M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 20bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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