16M-bit NOR Flash memory with a parallel interface, offering 2M x 8 or 1M x 16 word configurations. Features a 90ns maximum access time and operates from a 2.7V to 3.6V programming voltage, with a typical 3.3V supply. Packaged in a 48-pin TFBGA (9x8x1mm) with 0.8mm pitch, this surface-mount component supports bottom boot block architecture and operates across a -40°C to 85°C temperature range.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron M29W160DB90ZA6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
48
PCB
48
Package Length (mm)
9
Package Width (mm)
8
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
16Mbit
Interface Type
Parallel
Maximum Operating Current
10mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
90ns
Number of Words
2M/1M
Boot Block
Yes
Typical Operating Supply Voltage
3.3V
Address Bus Width
21/20bit
Location of Boot Block
Bottom
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M29W160DB90ZA6T Datasheet
Download the complete datasheet for Micron M29W160DB90ZA6T to view detailed technical specifications.
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