128M-bit NOR Flash memory with a parallel interface, featuring 8M x 16 organization and an 85ns maximum access time. This surface-mount component utilizes a 56-pin Very Thin Fine Pitch Ball Grid Array (VFBGA) package measuring 9mm x 7.7mm x 0.66mm with a 0.75mm pin pitch. It operates from a typical 1.8V supply, with programming voltages ranging from 1.7 to 2V and 8.5 to 12.6V. The memory architecture is sectored and asymmetrical, with a boot block located at the bottom, supporting both asynchronous and synchronous timing. Operating temperature range is -40°C to 85°C.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58LR128FB85ZB6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
56
PCB
56
Package Length (mm)
9
Package Width (mm)
7.7
Package Height (mm)
0.66
Seated Plane Height (mm)
0.66
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
128Mbit
Interface Type
Parallel
Maximum Operating Current
27mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
1.7 to 2|8.5 to 12.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
85ns
Number of Words
8M
Boot Block
Yes
Typical Operating Supply Voltage
1.8V
Address Bus Width
23bit
Location of Boot Block
Bottom
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
No
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron M58LR128FB85ZB6T Datasheet
Download the complete datasheet for Micron M58LR128FB85ZB6T to view detailed technical specifications.
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