32M-bit NOR Flash memory with a parallel interface, offering 4M x 8 or 2M x 16 word configurations. Features a 110ns maximum access time and operates from 2.7V to 3.6V programming voltage, with typical supply voltages of 3V or 3.3V. Packaged in a 56-pin TSOP (Thin Small Outline Package) with gull-wing leads for surface mounting. This component supports a 22/21-bit address bus and operates across a temperature range of -40°C to 85°C.
PackageTSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron M58LW032D110N6F technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6V
Timing Type
Asynchronous
Maximum Access Time
110ns
Number of Words
4M/2M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
22/21bit
Number of Bits per Word
8/16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58LW032D110N6F Datasheet
Download the complete datasheet for Micron M58LW032D110N6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.