128M-bit NOR Flash memory with a parallel interface, featuring an 8M x 16 word organization and a maximum access time of 115 ns. This surface-mount component operates from a 2.7 to 3.6 V programming voltage, with a typical supply voltage of 3.3 V. Packaged in a 64-pin Thin Profile Ball Grid Array (TBGA) with a 13mm x 10mm footprint and 0.85mm maximum height, it offers a 23-bit address bus and 16-bit data width. Operating temperature range is 0 °C to 70 °C.
PackageTBGA
MountingSurface Mount
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Technical Specifications
Micron M58LW128H115ZA1E technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TBGA |
| Package Description | Thin Profile Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 13 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.85(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 128Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 30mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 115ns |
| Number of Words | 8M |
| Boot Block | No |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 23bit |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Micron M58LW128H115ZA1E Datasheet
Download the complete datasheet for Micron M58LW128H115ZA1E to view detailed technical specifications.
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