The M58WR016KU60ZA6U is a 44-pin Very Thin Fine Pitch Ball Grid Array memory IC from Micron. It features a plastic package with a seated plane height of 1mm and a pin pitch of 0.5mm. The device is designed for surface mount applications and has a package length of 7.5mm and a package width of 5mm. The BGA package type is suitable for high-density packaging and provides a compact form factor.
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Micron M58WR016KU60ZA6U technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | VFBGA |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 44 |
| PCB | 44 |
| Package Length (mm) | 7.5 |
| Package Width (mm) | 5 |
| Package Height (mm) | 0.66 |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Micron M58WR016KU60ZA6U to view detailed technical specifications.
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