32M-bit NOR Flash memory with a 2M x 16 configuration, featuring a 70ns maximum access time. This integrated circuit supports both parallel and serial interfaces, operating at a typical 1.8V supply voltage with a 25mA maximum current. Packaged in a 56-pin VFBGA (Very Thin Fine Pitch Ball Grid Array) with a 0.75mm pin pitch, it is designed for surface mounting. The memory architecture is sectored and asymmetrical, with a 21-bit address bus and a boot block located at the top. Operating temperature range is -40°C to 85°C.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58WR032ET70ZB6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
56
PCB
56
Package Length (mm)
9
Package Width (mm)
7.7
Package Height (mm)
0.66
Seated Plane Height (mm)
0.66
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Interface Type
Parallel|Serial
Maximum Operating Current
25mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
1.7 to 2.2|11.4 to 12.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
70ns
Number of Words
2M
Boot Block
Yes
Typical Operating Supply Voltage
1.8V
Address Bus Width
21bit
Location of Boot Block
Top
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Micron M58WR032ET70ZB6T Datasheet
Download the complete datasheet for Micron M58WR032ET70ZB6T to view detailed technical specifications.
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