32M-bit NOR Flash memory, 2M x 16 configuration, featuring a parallel interface and 70ns maximum access time. This surface-mount component utilizes a 56-pin VFBGA package with a 0.75mm pin pitch, measuring 9mm x 7.7mm x 0.66mm. Operates at a typical 1.8V supply voltage with a maximum operating current of 30mA, supporting programming voltages from 1.7V to 2V and 11.4V to 12.6V. Includes a bottom boot block and asymmetrical sectored architecture, suitable for operation between -40°C and 85°C.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58WR032FB70ZB6F technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | VFBGA |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 9 |
| Package Width (mm) | 7.7 |
| Package Height (mm) | 0.66 |
| Seated Plane Height (mm) | 0.66 |
| Pin Pitch (mm) | 0.75 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 30mA |
| Block Organization | Asymmetrical |
| Architecture | Sectored |
| Programming Voltage | 1.7 to 2|11.4 to 12.6V |
| Timing Type | Asynchronous|Synchronous |
| Maximum Access Time | 70ns |
| Number of Words | 2M |
| Boot Block | Yes |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 21bit |
| Location of Boot Block | Bottom |
| Number of Bits per Word | 16bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Micron M58WR032FB70ZB6F Datasheet
Download the complete datasheet for Micron M58WR032FB70ZB6F to view detailed technical specifications.
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