64M-bit NOR Flash memory, featuring a parallel interface and 1.8V typical operating supply voltage. This component offers 4M words x 16 bits organization with a maximum access time of 60 ns. The VFBGA package, measuring 9mm x 7.7mm x 0.66mm with a 0.75mm pin pitch, supports surface mounting. It operates across a temperature range of -40°C to 85°C and includes a bottom boot block.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Micron M58WR064FB60ZB6T technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
56
PCB
56
Package Length (mm)
9
Package Width (mm)
7.7
Package Height (mm)
0.66
Seated Plane Height (mm)
0.66
Pin Pitch (mm)
0.75
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Asymmetrical
Architecture
Sectored
Programming Voltage
1.7 to 2|11.4 to 12.6V
Timing Type
Asynchronous|Synchronous
Maximum Access Time
60ns
Number of Words
4M
Boot Block
Yes
Typical Operating Supply Voltage
1.8V
Address Bus Width
22bit
Location of Boot Block
Bottom
Number of Bits per Word
16bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron M58WR064FB60ZB6T Datasheet
Download the complete datasheet for Micron M58WR064FB60ZB6T to view detailed technical specifications.
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