2Gbyte DDR2 SDRAM SODIMM module, operating at 667 MHz with a 64-bit data bus width. Features 16 chips organized as 256Mx64, utilizing a 128Mx8 chip configuration. This 200-pin module offers a 1.8V typical operating supply voltage and a CAS latency of 5. Designed for socket mounting with a 0.6mm pin pitch, it conforms to JEDEC MO-224 standards.
PackageSODIMM
MountingSocket
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Technical Specifications
Micron MT16HTF25664HZ-667H1 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DIMM
Package/Case
SODIMM
Package Description
Small Outline Dual In Line Memory Module
Lead Shape
No Lead
Pin Count
200
PCB
200
Package Length (mm)
67.75(Max)
Package Width (mm)
3.8(Max)
Package Height (mm)
30.15(Max)
Pin Pitch (mm)
0.6
Mounting
Socket
Jedec
MO-224
Main Category
DRAM Module
Total Density
2Gbyte
Module Type
200SODIMM
Maximum Access Time
900ns
Maximum Clock Rate
667MHz
Chip Density
1Gbit
Subcategory
DDR2 SDRAM
Data Bus Width
64bit
Number of Chip per Module
16
Organization
256Mx64
Typical Operating Supply Voltage
1.8V
Maximum Operating Current
1136mA
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.9V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Chip Configuration
128Mx8
ECC Support
No
Number of Ranks
Dual
CAS Latency
5
Compliance
Cage Code
6Y440
EU RoHS
Yes with Exemption
HTS Code
8473301140
Schedule B
8473300002
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT16HTF25664HZ-667H1 Datasheet
Download the complete datasheet for Micron MT16HTF25664HZ-667H1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.