2Gbyte DDR2 SDRAM SODIMM module, operating at 667 MHz with a 64-bit data bus width. Features 16 chips organized as 256Mx64, utilizing a 128Mx8 chip configuration. This 200-pin module offers a 1.8V typical operating supply voltage and a CAS latency of 5. Designed for socket mounting with a 0.6mm pin pitch, it conforms to JEDEC MO-224 standards.
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Micron MT16HTF25664HZ-667H1 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | DIMM |
| Package/Case | SODIMM |
| Package Description | Small Outline Dual In Line Memory Module |
| Lead Shape | No Lead |
| Pin Count | 200 |
| PCB | 200 |
| Package Length (mm) | 67.75(Max) |
| Package Width (mm) | 3.8(Max) |
| Package Height (mm) | 30.15(Max) |
| Pin Pitch (mm) | 0.6 |
| Mounting | Socket |
| Jedec | MO-224 |
| Main Category | DRAM Module |
| Total Density | 2Gbyte |
| Module Type | 200SODIMM |
| Maximum Access Time | 900ns |
| Maximum Clock Rate | 667MHz |
| Chip Density | 1Gbit |
| Subcategory | DDR2 SDRAM |
| Data Bus Width | 64bit |
| Number of Chip per Module | 16 |
| Organization | 256Mx64 |
| Typical Operating Supply Voltage | 1.8V |
| Maximum Operating Current | 1136mA |
| Min Operating Supply Voltage | 1.7V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Chip Configuration | 128Mx8 |
| ECC Support | No |
| Number of Ranks | Dual |
| CAS Latency | 5 |
| Cage Code | 6Y440 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8473301140 |
| Schedule B | 8473300002 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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