PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron MT29F2G08AADWP-ET:D technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Interface Type
Serial-SPI
Timing Type
Synchronous
Boot Block
No
Typical Operating Supply Voltage
3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT29F2G08AADWP-ET:D Datasheet
Download the complete datasheet for Micron MT29F2G08AADWP-ET:D to view detailed technical specifications.
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