SLC NAND flash memory component provides an 8 Gb density with an x8 bus interface in a 48-pin TSOP package. It uses single-level-cell NAND technology and a 1G x 8 organization. The device family supports 3.3 V I/O operation and industrial temperature operation from -40 °C to 85 °C. The WP package code corresponds to a 12.00 mm by 20.00 mm by 1.20 mm TSOP package in closely related Micron catalog entries.
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| Memory Type | SLC NAND Flash |
| Density | 8Gb |
| Organization | 1G x 8 |
| Bus Width | x8 |
| I/O Voltage | 3.3V |
| Operating Temperature | -40 to +85°C |
| Pin Count | 48pins |
| Package | TSOP |
| Package Dimensions | 12.00 x 20.00 x 1.20mm |
| Technology | SLC |
These are design resources that include the Micron MT29F8G08ABABAWP-12IT
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