8G-bit SLC NAND Flash memory with a parallel interface, featuring 1G x 8 organization and a 3.3V operating voltage. This Thin Small Outline Package (TSOP-I) component offers surface mount capability with 48 gull-wing leads on a 0.5mm pitch. Designed for symmetrical block organization and sectored architecture, it operates across a temperature range of -40°C to 85°C with a maximum operating current of 35mA.
PackageTSOP-I
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron MT29F8G08ABACAWP-IT:C technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP-I
Package Description
Thin Small Outline Package (Type I)
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Mounting
Surface Mount
Density
8Gbit
Interface Type
Parallel
Maximum Operating Current
35mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Number of Words
1G
Boot Block
No
Typical Operating Supply Voltage
3.3V
Address Bus Width
31bit
Number of Bits per Word
8bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT29F8G08ABACAWP-IT:C Datasheet
Download the complete datasheet for Micron MT29F8G08ABACAWP-IT:C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.