PackageVFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron MT45W2MW16BGB-708 AT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
54
PCB
54
Package Material
Plastic
Mounting
Surface Mount
Density
32Mbit
Maximum Access Time
70ns
Number of Words
2M
Number of Bits per Word
16bit
Density in Bits
33554432bit
Timing Type
Asynchronous
Number of Ports
1
Typical Operating Supply Voltage
1.8V
Min Operating Supply Voltage
1.7V
Max Operating Supply Voltage
1.95V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320002
Schedule B
8542320015
ECCN
EAR99
Automotive
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MT45W2MW16BGB-708 AT Datasheet
Download the complete datasheet for Micron MT45W2MW16BGB-708 AT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.