DDR2 SDRAM chip, 2G bit density, organized as 128Mx16 with a 16-bit data bus width. Features a maximum clock rate of 667 MHz and an 84-pin FBGA package with a 0.8mm pin pitch. Operates at a typical supply voltage of 1.8V, with a temperature range of -40°C to 85°C. Surface mountable with a fine pitch ball grid array package.
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Micron MT47H128M16-HG-3EIT:A technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
84
PCB
84
Package Length (mm)
14
Package Width (mm)
11.5
Package Height (mm)
1.2(Max) - 0.25(Min)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Type
DDR2 SDRAM
Organization
128Mx16
Data Bus Width
16bit
Maximum Clock Rate
667MHz
Number of Internal Banks
8
Number of Words per Bank
16M
Maximum Access Time
0.45ns
Density in Bits
2147483648bit
Address Bus Width
17bit
Maximum Operating Current
275mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron MT47H128M16-HG-3EIT:A Datasheet
Download the complete datasheet for Micron MT47H128M16-HG-3EIT:A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.