1Gbit DDR2 SDRAM memory chip, organized as 256Mx4, featuring a 4-bit data bus width and a maximum clock rate of 667 MHz. This surface-mount component utilizes a 60-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch and dimensions of 10mm x 8mm x 0.8mm. It operates with a typical supply voltage of 1.8V, a maximum access time of 0.45 ns, and supports 8 internal banks with 32M words per bank. Operating temperature range is 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Micron MT47H256M4CF-3:H technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
10
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
1Gbit
Type
DDR2 SDRAM
Organization
256Mx4
Data Bus Width
4bit
Maximum Clock Rate
667MHz
Number of Internal Banks
8
Number of Words per Bank
32M
Maximum Access Time
0.45ns
Density in Bits
1073741824bit
Address Bus Width
17bit
Maximum Operating Current
115mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320032
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron MT47H256M4CF-3:H Datasheet
Download the complete datasheet for Micron MT47H256M4CF-3:H to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.