DDR2 SDRAM memory chip with 2Gbit density, organized as 256Mx8. Features an 8-bit data bus width and a maximum clock rate of 667 MHz. This surface-mount component utilizes a 60-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch. Operates with a typical supply voltage of 1.8V and a temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Micron MT47H256M8-HG-3IT:A technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
14
Package Width (mm)
11.5
Package Height (mm)
1.2(Max) - 0.25(Min)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Type
DDR2 SDRAM
Organization
256Mx8
Data Bus Width
8bit
Maximum Clock Rate
667MHz
Number of Internal Banks
8
Number of Words per Bank
32M
Maximum Access Time
0.45ns
Density in Bits
2147483648bit
Address Bus Width
18bit
Maximum Operating Current
170mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron MT47H256M8-HG-3IT:A Datasheet
Download the complete datasheet for Micron MT47H256M8-HG-3IT:A to view detailed technical specifications.
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