2Gbit DDR2 SDRAM memory chip, organized as 512Mx4, featuring a 4-bit data bus width and a maximum clock rate of 667 MHz. This surface-mount component utilizes an 18-bit address bus and offers 8 internal banks, each with 64M words. Packaged in a 60-pin Fine Pitch Ball Grid Array (FBGA) with a 0.8mm pin pitch, it operates at a typical 1.8V supply voltage and a temperature range of -40°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Micron MT47H512M4-HG-3EIT:A technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
14
Package Width (mm)
11.5
Package Height (mm)
1.2(Max) - 0.25(Min)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Type
DDR2 SDRAM
Organization
512Mx4
Data Bus Width
4bit
Maximum Clock Rate
667MHz
Number of Internal Banks
8
Number of Words per Bank
64M
Maximum Access Time
0.45ns
Density in Bits
2147483648bit
Address Bus Width
18bit
Maximum Operating Current
170mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron MT47H512M4-HG-3EIT:A Datasheet
Download the complete datasheet for Micron MT47H512M4-HG-3EIT:A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.