1Gbit DDR2 SDRAM memory chip, organized as 64Mx16, featuring a 16-bit data bus width and a maximum clock rate of 667 MHz. This surface-mount component utilizes a fine-pitch ball grid array (FBGA) package with 84 pins, a 0.8mm pin pitch, and dimensions of 12.5mm x 8mm x 0.8mm. Operating at a typical supply voltage of 1.8V, it offers 8 internal banks and 8M words per bank, with a maximum access time of 0.45 ns. Extended temperature range from -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 84 |
| PCB | 84 |
| Package Length (mm) | 12.5 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 1Gbit |
| Type | DDR2 SDRAM |
| Organization | 64Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 667MHz |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 8M |
| Maximum Access Time | 0.45ns |
| Density in Bits | 1073741824bit |
| Address Bus Width | 16bit |
| Maximum Operating Current | 135mA |
| Typical Operating Supply Voltage | 1.8V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Supply Voltage | 1.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320032 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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