Automotive DDR2 SDRAM memory chip, 512Mbit density organized as 64Mx8 with an 8-bit data bus width. Features a 60-pin FBGA package with 0.8mm pin pitch, surface mountable, and a 1.8V typical operating supply voltage. Operates at a maximum clock rate of 800 MHz with 4 internal banks and 16M words per bank. Extended temperature range from -40°C to 105°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 60 |
| PCB | 60 |
| Package Length (mm) | 10 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 512Mbit |
| Type | DDR2 SDRAM |
| Organization | 64Mx8 |
| Data Bus Width | 8bit |
| Maximum Clock Rate | 800MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 16M |
| Maximum Access Time | 0.4ns |
| Density in Bits | 536870912bit |
| Address Bus Width | 16bit |
| Maximum Operating Current | 205mA |
| Typical Operating Supply Voltage | 1.8V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Supply Voltage | 1.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320028 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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