PackageFBGA
MountingSurface Mount
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Technical Specifications
Micron MTFC32GHKDN-WT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
169
PCB
169
Package Material
Plastic
Mounting
Surface Mount
Density
32Gbit
Number of Words
4G
Boot Block
No
Typical Operating Supply Voltage
3.3V
Number of Bits per Word
8bit
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Micron MTFC32GHKDN-WT Datasheet
Download the complete datasheet for Micron MTFC32GHKDN-WT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.