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Technical Specifications
Micron MTFC32GHKDN-WT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 169 |
| PCB | 169 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 32Gbit |
| Number of Words | 4G |
| Boot Block | No |
| Typical Operating Supply Voltage | 3.3V |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Micron MTFC32GHKDN-WT Datasheet
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