256M-bit NOR Flash memory with Serial (SPI, Dual SPI, Quad SPI) interface, offering 32M x 4-bit organization and an 8ns maximum access time. This surface-mount component features a 24-pin Thin Profile Ball Grid Array (TFBGA) package measuring 8mm x 6mm x 0.79mm with a 1mm pin pitch. Operating at 3V/3.3V, it supports a programming voltage range of 2.7 to 3.6V and 8.5 to 9.5V, with a maximum operating current of 20mA. The memory architecture is sectored with symmetrical blocks and includes boot blocks at the bottom or top. Designed for operation between -40°C and 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
Micron N25Q256A13E1240G technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Profile Ball Grid Array
Lead Shape
Ball
Pin Count
24
PCB
24
Package Length (mm)
8
Package Width (mm)
6
Package Height (mm)
0.79
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Programming Voltage
2.7 to 3.6|8.5 to 9.5V
Timing Type
Synchronous
Maximum Access Time
8ns
Number of Words
32M
Boot Block
Yes
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
32bit
Location of Boot Block
Bottom|Top
Number of Bits per Word
4bit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Micron N25Q256A13E1240G Datasheet
Download the complete datasheet for Micron N25Q256A13E1240G to view detailed technical specifications.
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