PackageTSOP
Current30mA
MountingSurface Mount
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Technical Specifications
Micron NAND01GW3B2CN6F technical specifications.
General
| Access Time-Max | 25us |
| Address Bus Width | 8b |
| Package/Case | TSOP |
| Density | 1Gb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Memory Type | NAND, |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 3.3V |
| Packaging | Tape and Reel |
| Page Size | 64Words |
| RoHS Compliant | Yes |
| Supply Current | 30mA |
| Sync/Async | Asynchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Micron NAND01GW3B2CN6F Datasheet
Download the complete datasheet for Micron NAND01GW3B2CN6F to view detailed technical specifications.
No datasheet is available for this part.