4G-bit parallel NAND Flash memory, featuring a 512M x 8 organization and sectored architecture. This surface-mount component operates at 1.8V with a maximum access time of 25,000 ns and a maximum operating current of 15 mA. Encased in a 63-pin VFBGA package measuring 12mm x 9.5mm x 0.7mm, it offers a 30-bit address bus and operates across a temperature range of -40°C to 85°C.
Sign in to ask questions about the Micron NAND04GR3B2AZA6F datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Micron NAND04GR3B2AZA6F technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | VFBGA |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 63 |
| PCB | 63 |
| Package Length (mm) | 12 |
| Package Width (mm) | 9.5 |
| Package Height (mm) | 0.7(Max) |
| Seated Plane Height (mm) | 1.05(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 4Gbit |
| Interface Type | Parallel |
| Maximum Operating Current | 15mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous |
| Maximum Access Time | 25000ns |
| Number of Words | 512M |
| Boot Block | No |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 30bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for Micron NAND04GR3B2AZA6F to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
