4G-bit parallel NAND flash memory with a 512M x 8 organization, featuring a 1.8V operating supply voltage and 30-bit address bus. This VFBGA package offers a 63-pin count, surface mount configuration, and dimensions of 12mm x 9.5mm x 0.7mm. It operates asynchronously with a maximum access time of 25,000 ns and a maximum operating current of 15 mA, suitable for temperatures from -40°C to 85°C.
Sign in to ask questions about the Micron NAND04GR3B2CZA6 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Micron NAND04GR3B2CZA6 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | VFBGA |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 63 |
| PCB | 63 |
| Package Length (mm) | 12 |
| Package Width (mm) | 9.5 |
| Package Height (mm) | 0.7(Max) |
| Seated Plane Height (mm) | 1.05(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 4Gbit |
| Interface Type | Parallel |
| Maximum Operating Current | 15mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous |
| Maximum Access Time | 25000ns |
| Number of Words | 512M |
| Boot Block | No |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 30bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 6Y440 |
| EU RoHS | No |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Micron NAND04GR3B2CZA6 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
