4G-bit parallel NAND Flash memory, organized as 512M x 8 words, operates at 3V/3.3V with a maximum access time of 25µs. This surface-mount TSOP package features 48 gull-wing leads on a 0.5mm pitch, measuring 12mm x 18.4mm x 1mm. The component utilizes a sectored, symmetrical block architecture and has a maximum operating current of 30mA, suitable for 0°C to 70°C operation.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND04GW3B2CN1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
4Gbit
Interface Type
Parallel
Maximum Operating Current
30mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
25000ns
Number of Words
512M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
30bit
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Micron NAND04GW3B2CN1 Datasheet
Download the complete datasheet for Micron NAND04GW3B2CN1 to view detailed technical specifications.
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