PackageTFSOP
MountingSurface Mount
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Technical Specifications
Micron NAND04GW3B2DN6E technical specifications.
General
Access Time
25ns
Address Bus Width
29b
Package/Case
TFSOP
Density
4Gb
Interface
Parallel
Max Operating Temperature
85°C
Memory Size
4Gb
Memory Type
Non-Volatile, , FLASH, NAND
Min Operating Temperature
-40°C
Mount
Surface Mount
Page Size
2KB
Radiation Hardening
No
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Micron NAND04GW3B2DN6E Datasheet
Download the complete datasheet for Micron NAND04GW3B2DN6E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.