8G-bit MLC NAND Flash memory with a parallel interface, operating at 3.3V. This Thin Small Outline Package (TSOP) component features 48 gull-wing leads for surface mounting, a 0.5mm pin pitch, and a symmetrical, sectored block organization. It offers a maximum access time of 60,000 ns and operates within a temperature range of -40°C to 85°C.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Micron NAND08GA3C2AN6E datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP |
| Package Description | Thin Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12 |
| Package Width (mm) | 18.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 8Gbit |
| Interface Type | Parallel |
| Maximum Operating Current | 20mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Programming Voltage | 2.7 to 3.6V |
| Timing Type | Asynchronous |
| Maximum Access Time | 60000ns |
| Number of Words | 1G |
| Boot Block | No |
| Typical Operating Supply Voltage | 3.3V |
| Address Bus Width | 8bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 6Y440 |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Micron NAND08GA3C2AN6E to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
