256M-bit SLC NAND Flash memory, featuring a parallel interface and 1.8V operating voltage. This integrated circuit offers a density of 256 megabits with a 32M x 8 word organization and a 27-bit address bus. It is housed in a 48-pin USOP (Micro Small-Outline Package) with gull-wing leads for surface mounting. Key specifications include a maximum access time of 12µs and an operating temperature range of 0°C to 70°C.
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Micron NAND256R3A2BV1F technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | USOP |
| Package Description | Micro Small-Outline Package |
| Lead Shape | Gull-wing Lead (L-Lead) |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12 |
| Package Width (mm) | 15.4 |
| Package Height (mm) | 0.52 |
| Seated Plane Height (mm) | 0.65(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Interface Type | Parallel |
| Maximum Operating Current | 15mA |
| Block Organization | Symmetrical |
| Architecture | Sectored |
| Timing Type | Asynchronous |
| Maximum Access Time | 12000ns |
| Number of Words | 32M |
| Boot Block | No |
| Typical Operating Supply Voltage | 1.8V |
| Address Bus Width | 27bit |
| Number of Bits per Word | 8bit |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | 6Y440 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | 3A991.b.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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