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Technical Specifications
Micron NAND256R3A2BZA6E technical specifications.
General
| Access Time | 50ns |
| Address Bus Width | 25b |
| Package/Case | TFBGA |
| Density | 256Mb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Size | 256Mb |
| Memory Type | Non-Volatile, , FLASH, SLC NAND |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.8V |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
Compliance
| RoHS | Compliant |
Datasheet
Micron NAND256R3A2BZA6E Datasheet
Download the complete datasheet for Micron NAND256R3A2BZA6E to view detailed technical specifications.
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