PackageTSOP
Voltage3V
Current20mA
MountingSurface Mount
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Technical Specifications
Micron NAND256W3A2BN6F technical specifications.
General
| Access Time-Max | 12us |
| Address Bus Width | 25b |
| Package/Case | TSOP |
| Density | 256Mb |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Memory Type | SLC NAND, , NAND |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 20mA |
| Sync/Async | Asynchronous |
| Voltage | 3V |
| DC Rated Voltage | 3V |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Micron NAND256W3A2BN6F Datasheet
Download the complete datasheet for Micron NAND256W3A2BN6F to view detailed technical specifications.
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