PackageTSOP
Voltage3V
Current20mA
MountingSurface Mount
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Technical Specifications
Micron NAND256W3A2BN6F technical specifications.
General
Access Time-Max
12us
Address Bus Width
25b
Package/Case
TSOP
Density
256Mb
Interface
Parallel
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Type
SLC NAND, , NAND
Min Supply Voltage
2.7V
Mount
Surface Mount
Packaging
Tape and Reel
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
20mA
Sync/Async
Asynchronous
Voltage
3V
DC Rated Voltage
3V
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Micron NAND256W3A2BN6F Datasheet
Download the complete datasheet for Micron NAND256W3A2BN6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.