PackageTFBGA
Voltage3.3V
MountingSurface Mount
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Technical Specifications
Micron NAND256W3A2BZAXE technical specifications.
General
Access Time
50ns
Address Bus Width
25b
Package/Case
TFBGA
Density
256Mb
Interface
Parallel
Max Operating Temperature
85°C
Memory Size
256Mb
Memory Type
Non-Volatile, , FLASH, NAND
Min Operating Temperature
-40°C
Mount
Surface Mount
Operating Supply Voltage
3V
Packaging
Tray
Page Size
528B
Radiation Hardening
No
RoHS Compliant
Yes
Voltage
3.3V
DC Rated Voltage
3.3V
Compliance
RoHS
Compliant
Datasheet
Micron NAND256W3A2BZAXE Datasheet
Download the complete datasheet for Micron NAND256W3A2BZAXE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.