256M-bit SLC NAND Flash memory, featuring a parallel interface and 3V/3.3V operating voltage. This Thin Small Outline Package (TSOP) component offers 32M words x 8 bits organization with a maximum access time of 12µs. Designed for surface mounting, it utilizes a symmetrical, sectored architecture and operates within a temperature range of 0°C to 70°C. The 48-pin TSOP package has a 0.5mm pin pitch and a plastic construction.
PackageTSOP
MountingSurface Mount
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Technical Specifications
Micron NAND256W3A2CN1F technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSOP
Package Description
Thin Small Outline Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
12
Package Width (mm)
18.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Interface Type
Parallel
Maximum Operating Current
20mA
Block Organization
Symmetrical
Architecture
Sectored
Timing Type
Asynchronous
Maximum Access Time
12000ns
Number of Words
32M
Boot Block
No
Typical Operating Supply Voltage
3|3.3V
Address Bus Width
27bit
Number of Bits per Word
8bit
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
6Y440
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
3A991.b.1.a
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Micron NAND256W3A2CN1F Datasheet
Download the complete datasheet for Micron NAND256W3A2CN1F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.