256M-bit SLC NAND Flash memory, featuring a parallel interface and 3V/3.3V operating voltage. This Thin Small Outline Package (TSOP) component offers 32M words x 8 bits organization with a maximum access time of 12µs. Designed for surface mounting, it utilizes a symmetrical, sectored architecture and operates within a temperature range of 0°C to 70°C. The 48-pin TSOP package has a 0.5mm pin pitch and a plastic construction.
Micron NAND256W3A2CN1F technical specifications.
Download the complete datasheet for Micron NAND256W3A2CN1F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.