PackageTFSOP
Current15mA
MountingSurface Mount
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Technical Specifications
Micron NAND512R3A2SN6F technical specifications.
General
Access Time
50ns
Access Time-Max
15us
Address Bus Width
26b
Package/Case
TFSOP
Density
512Mb
Interface
Parallel
Max Operating Temperature
85°C
Max Supply Voltage
1.95V
Memory Size
512Mb
Memory Type
Non-Volatile, , FLASH, SLC NAND
Min Operating Temperature
-40°C
Min Supply Voltage
1.7V
Mount
Surface Mount
Operating Supply Voltage
1.8V
Packaging
Tape and Reel
Page Size
512B
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
15mA
Sync/Async
Asynchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Micron NAND512R3A2SN6F Datasheet
Download the complete datasheet for Micron NAND512R3A2SN6F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.