Frequency100MHz
PackageLBGA
MountingSurface Mount
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Technical Specifications
Microsemi A2F060M3E-FGG256 technical specifications.
General
Package/Case
LBGA
Core Architecture
ARM
Data Rate
400Kbps
Frequency
100MHz
Interface
I2C, SPI, UART, USART, EBI/EMI
Max Frequency
100MHz
Max Operating Temperature
85°C
Max Supply Voltage
1.575V
Memory Size
36864b
Min Operating Temperature
0°C
Min Supply Voltage
1.425V
Mount
Surface Mount
Number of Gates
60000
Number of I/Os
108
Number of Logic Elements/Cells
660
Operating Supply Current
3mA
Operating Supply Voltage
1.5V
Package Quantity
90
Peripherals
POR, WDT, DMA
RAM Size
16384b
RoHS Compliant
Yes
Series
SmartFusion®
Compliance
RoHS
Compliant
Datasheet
Microsemi A2F060M3E-FGG256 Datasheet
Download the complete datasheet for Microsemi A2F060M3E-FGG256 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.