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Technical Specifications
Microsemi A2F060M3E-FGG256 technical specifications.
General
| Package/Case | LBGA |
| Core Architecture | ARM |
| Data Rate | 400Kbps |
| Frequency | 100MHz |
| Interface | I2C, SPI, UART, USART, EBI/EMI |
| Max Frequency | 100MHz |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 1.575V |
| Memory Size | 36864b |
| Min Operating Temperature | 0°C |
| Min Supply Voltage | 1.425V |
| Mount | Surface Mount |
| Number of Gates | 60000 |
| Number of I/Os | 108 |
| Number of Logic Elements/Cells | 660 |
| Operating Supply Current | 3mA |
| Operating Supply Voltage | 1.5V |
| Package Quantity | 90 |
| Peripherals | POR, WDT, DMA |
| RAM Size | 16384b |
| RoHS Compliant | Yes |
| Series | SmartFusion® |
Compliance
| RoHS | Compliant |
Datasheet
Microsemi A2F060M3E-FGG256 Datasheet
Download the complete datasheet for Microsemi A2F060M3E-FGG256 to view detailed technical specifications.
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