256K-bit OTP EPROM, organized as 32K x 8, offers a 300ns maximum access time. This parallel interface memory features a 32-pin Ceramic Leadless Chip Carrier (CLLCC) package with no leads, designed for surface mounting. Operating from a 4.5V to 5.5V supply, it supports external in-system programmability and functions across a -55°C to 125°C temperature range.
PackageCLLCC
MountingSurface Mount
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Technical Specifications
Micross AS27C256 -30ECAXT technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LLCC |
| Package/Case | CLLCC |
| Package Description | Ceramic Leadless Chip Carrier |
| Lead Shape | No Lead |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 14.22(Max) |
| Package Width (mm) | 11.63(Max) |
| Package Height (mm) | 3.05(Max) |
| Seated Plane Height (mm) | 3.05(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Jedec | MO-041-AB |
| Density | 256Kbit |
| Maximum Access Time | 300ns |
| Interface Type | Parallel |
| Maximum Operating Current | 25mA |
| Organization | 32Kx8 |
| Reprogramming Technique | OTP |
| Typical Operating Supply Voltage | 5V |
| In-System Programmability | External |
| Density in Bits | 262144bit |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Supply Voltage | 4.5V |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Programming Voltage | 4.5 to 5.5|12.5 to 13V |
Compliance
| Cage Code | 0LRZ0 |
| HTS Code | 8542320061 |
| Schedule B | 8542320060 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micross AS27C256 -30ECAXT Datasheet
Download the complete datasheet for Micross AS27C256 -30ECAXT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.