1M-bit EEPROM with parallel interface, organized as 128K x 8. Features a 3.3V operating supply voltage and a maximum access time of 300 ns. Housed in a 32-pin Chip Scale Package (CSP) with a 1.4mm pin pitch, this ceramic Ball Grid Array (BGA) component supports surface mounting. Offers 10 years of data retention and hardware data protection, operating across a temperature range of -55°C to 125°C.
PackageCSP
MountingSurface Mount
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Technical Specifications
Micross AS58LC1001SF-30/XT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSP |
| Package Description | Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 21.08(Max) |
| Package Width (mm) | 11.3(Max) |
| Package Height (mm) | 3.81(Max) |
| Pin Pitch (mm) | 1.4 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Density | 1Mbit |
| Interface Type | Parallel |
| Maximum Access Time | 300ns |
| Organization | 128Kx8 |
| Maximum Operating Current | 20mA |
| Typical Operating Supply Voltage | 3.3V |
| Density in Bits | 1048576bit |
| Data Retention | 10(Min)Year |
| Hardware Data Protection | Yes |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Programming Voltage | 3 to 3.6V |
Compliance
| Cage Code | 0LRZ0 |
| HTS Code | 8542320051 |
| Schedule B | 8542320050 |
| ECCN | 3A001.a.2.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Micross AS58LC1001SF-30/XT Datasheet
Download the complete datasheet for Micross AS58LC1001SF-30/XT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.