256M bit DDR SDRAM memory chip, organized as 16Mx4, featuring a 4-bit data bus width and a maximum clock rate of 333 MHz. This surface-mount component utilizes a 60-pin TSOP-II package with gull-wing leads, a 0.65mm pin pitch, and dimensions of 22.22mm x 10.16mm x 1mm. It operates with a typical supply voltage of 2.5V, a maximum access time of 0.7 ns, and supports 4 internal banks with 4M words per bank.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSOP-II |
| Package Description | Thin Small Outline Package (Type II) |
| Lead Shape | Gull-wing |
| Pin Count | 60 |
| PCB | 60 |
| Package Length (mm) | 22.22 |
| Package Width (mm) | 10.16 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Type | DDR SDRAM |
| Organization | 16Mx4 |
| Data Bus Width | 4bit |
| Maximum Clock Rate | 333MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 4M |
| Maximum Access Time | 0.7ns |
| Density in Bits | 268435456bit |
| Address Bus Width | 15bit |
| Maximum Operating Current | 350mA |
| Typical Operating Supply Voltage | 2.5V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Supply Voltage | 2.3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | SFP67 |
| HTS Code | 8542320024 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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