256M bit DDR SDRAM memory chip, organized as 8Mx8, features an 8-bit data bus and a 15-bit address bus. Operating at a maximum clock rate of 266 MHz, this component offers 4 internal banks with 2M words per bank and a maximum access time of 0.75 ns. Encased in a 60-pin SOC BGA package with a 1mm pin pitch, it supports surface mounting and operates from a 2.3V to 2.7V supply, with a typical voltage of 2.5V. The plastic package measures 13mm x 8mm x 0.8mm, with a seated plane height of 1.2mm, and has an operating temperature range of 0°C to 70°C.
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| Package/Case | SOC BGA |
| Pin Count | 60 |
| PCB | 60 |
| Package Length (mm) | 13 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 256Mbit |
| Type | DDR SDRAM |
| Organization | 8Mx8 |
| Data Bus Width | 8bit |
| Maximum Clock Rate | 266MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 2M |
| Maximum Access Time | 0.75ns |
| Density in Bits | 268435456bit |
| Address Bus Width | 15bit |
| Maximum Operating Current | 300mA |
| Typical Operating Supply Voltage | 2.5V |
| Max Operating Supply Voltage | 2.7V |
| Min Operating Supply Voltage | 2.3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | SFP67 |
| HTS Code | 8542320024 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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