Chip multilayer ceramic capacitor provides 22,000 pF capacitance with ±10% tolerance and a 16 Vdc rating. The X5R dielectric operates from -55 °C to 85 °C with ±15% capacitance change over its temperature-characteristic range. The two-terminal 0201 size body measures 0.6 mm by 0.3 mm with 0.3 mm thickness. It supports reflow soldering, has MSL 1 moisture sensitivity, and is supplied in paper tape on a 180 mm reel for the D packaging suffix. The part is lead-free and compliant with RoHS and REACH according to Murata product data.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Murata Electronics North America GRM033R61C223KE84D datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Product Type | Chip Multilayer Ceramic Capacitor |
| Series | GRM |
| Capacitance | 22000pF |
| Capacitance | 0.022µF |
| Capacitance Tolerance | ±10% |
| Rated Voltage | 16Vdc |
| Temperature Characteristic | X5R |
| Capacitance Change Rate | ±15% |
| Operating Temperature | -55 to 85°C |
| Size Code | 0201 / 0603M |
| Length | 0.6 ±0.03mm |
| Width | 0.3 ±0.03mm |
| Thickness | 0.3 ±0.03mm |
| External Terminal Distance G | 0.2 Min.mm |
| External Terminal Size E | 0.1 to 0.2mm |
| Shape | Two-terminal |
| Mounting | Reflow soldering |
| Moisture Sensitivity Level | 1 |
| Reference Mass | 0.33mg |
| AEC-Q200 Support | No |
| RoHS | Compliant |
| REACH | Compliant |
| Lead Free | Yes |
| Halogen Free | No |
Download the complete datasheet for Murata Electronics North America GRM033R61C223KE84D to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
These are design resources that include the Murata Electronics North America GRM033R61C223KE84D
Bill of Materials for the Omi2 wearable device featuring Nordic nRF5340 and nRF7002 for wireless connectivity, motion sensing, and dual MEMS microphones.
