The 2.4 GHz wireless connectivity module combines Wi-Fi 4 with Bluetooth 5.1 BR/EDR/LE using an Infineon CYW43439 chipset. Wi-Fi operation supports 802.11b/g/n with up to 65 Mbps PHY data rate, and Bluetooth operation supports up to 3 Mbps PHY data rate. Host interfaces include SDIO for WLAN and UART for Bluetooth, with GPIO, SDIO, and UART peripheral interfaces. The shielded resin SMT module measures 6.95 mm by 5.15 mm by 1.1 mm and operates from -40 °C to 85 °C. Tape-and-reel packaging is specified, and the module is listed as RoHS and REACH compliant.
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| Type name | Type 1YN |
| Chipset | CYW43439 |
| IC manufacturer | Infineon |
| Wireless technology | Bluetooth, Wi-Fi |
| Wi-Fi standard | Wi-Fi 4 |
| Bluetooth standard | 5.1 BR/EDR/LE |
| Frequency | 2.4GHz |
| Host interface Wi-Fi | SDIO |
| Host interface Bluetooth | UART |
| Peripheral interface | GPIO/SDIO/UART |
| Dimensions | 6.95 × 5.15 × 1.1mm |
| Operating temperature | -40 to 85°C |
| Interface voltage | 1.8, 3.3V |
| Mounting type | SMT |
| Integrated antenna | No |
| FCC/IC certified | Yes |
| ETSI report | Yes |
| Wi-Fi transmit current | 320 @ 11 Mbps (2.4 GHz)mA |
| Bluetooth transmit current | 28mA |
| Receive mode current | 47mA |
| RoHS | Compliant |
| REACH | Compliant |
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