PackageTSSOP
MountingSurface Mount
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Technical Specifications
Nexperia 74AVCH16T245DGG,18 technical specifications.
General
Package/Case
TSSOP
Pin Count
48
PCB
48
Package Length (mm)
12.6(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153ED
Logic Family
AVC
Logic Function
Voltage Level Translator
Process Technology
CMOS
Output Type
3-State
Maximum Low Level Output Current
12mA
Maximum High Level Output Current
-12mA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H2HX9
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Nexperia 74AVCH16T245DGG,18 Datasheet
Download the complete datasheet for Nexperia 74AVCH16T245DGG,18 to view detailed technical specifications.
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